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1. general description the cbt3244a provides eight bits of high-speed ttl-compatible bus switching in a standard '244 device pinout. the low on-state resistance of the switch allows connections to be made with minimal propagation delay. the cbt3244a device is organized as two 4-bit low-impedance switches with separate output-enable ( oe) inputs. when oe is low, the switch is on and data can ?ow from port a to port b, or vice versa. when oe is high, the switch is open and high-impedance state exists between the two ports. the cbt3244a is characterized for operation from - 40 cto+85 c. 2. features n standard '244-type pinout n 5 w switch connection between two ports n ttl compatible control input levels n package options include: u plastic small outline (so20) u shrink small outline (ssop20) u shrink small outline, qsop (ssop20) u thin shrink small outline (tssop20) u depopulated heatsink very thin quad ?at package, no leads (dhvqfn20) n latch-up protection exceeds 500 ma per jesd78 n esd protection exceeds 2000 v hbm per jesd22-a114, 200 v mm per jesd22-a115 and 1000 v cdm per jesd22-c101 cbt3244a octal bus switch with quad output enables rev. 02 15 september 2005 product data sheet
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 2 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables 3. ordering information [1] also known as qsop20. standard packing quantities and other packaging data are available at www.standardics.philips.com/packaging . 4. functional diagram table 1: ordering information t amb = - 40 c to +85 c type number topside mark package name description version cbt3244abq ct3244a dhvqfn20 plastic dual in-line compatible thermal enhanced very thin quad ?at package; no leads; 20 terminals; body 2.5 4.5 0.85 mm sot764-1 cbt3244apw ct3244a tssop20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 cbt3244ads ct3244ads ssop20 [1] plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm sot724-1 cbt3244adb ct3244a ssop20 plastic shrink small outline package; 20 leads; body width 5.3 mm sot339-1 cbt3244ad cbt3244ad so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1 fig 1. logic diagram of cbt3244a cbt3244a 002aab655 1a1 1a4 1b1 1b4 1oe 2a1 2a4 2b1 2b4 2oe
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 3 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables 5. pinning information 5.1 pinning fig 2. pin con?guration for tssop20 fig 3. pin con?guration for so20 fig 4. pin con?guration for ssop20 (qsop) fig 5. pin con?guration for ssop20 cbt3244apw 1oe v cc 1a1 2oe 2b4 1b1 1a2 2a4 2b3 1b2 1a3 2a3 2b2 1b3 1a4 2a2 2b1 1b4 gnd 2a1 002aab651 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 v cc 2oe 1b1 2a4 1b2 2a3 1b3 2a2 1b4 2a1 1oe 1a1 2b4 1a2 2b3 1a3 2b2 1a4 2b1 gnd cbt3244ad 002aab654 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 1oe v cc 1a1 2oe 2b4 1b1 1a2 2a4 2b3 1b2 1a3 2a3 2b2 1b3 1a4 2a2 2b1 1b4 gnd 2a1 cbt3244ads 002aab652 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 1oe v cc 1a1 2oe 2b4 1b1 1a2 2a4 2b3 1b2 1a3 2a3 2b2 1b3 1a4 2a2 2b1 1b4 gnd 2a1 cbt3244adb 002aab653 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 4 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables 5.2 pin description (1) the die substrate is attached to this pad using conductive die attach material. it cannot be used as a supply pin or input. fig 6. pin con?guration for dhvqfn20 002aab650 cbt3244abq transparent top view 1b4 1a4 2b1 2a2 2b2 1b3 1a3 2a3 2b3 1b2 1a2 2a4 2b4 1b1 1a1 2oe gnd 2a1 1oe v cc 9 12 8 13 7 14 6 15 5 16 4 17 3 18 2 19 10 11 1 20 terminal 1 index area gnd (1) table 2: pin description symbol pin description 1 oe 1 output enable (active low) 1a1, 1a2, 1a3, 1a4 2, 4, 6, 8 inputs 2a1, 2a2, 2a3, 2a4 11, 13, 15, 17 inputs 1b1, 1b2, 1b3, 1b4 18, 16, 14, 12 outputs 2b1, 2b2, 2b3, 2b4 9, 7, 5, 3 outputs gnd 10 ground (0 v) 2 oe 19 output enable (active low) v cc 20 positive supply voltage
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 5 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables 6. functional description refer to figure 1 logic diag r am of cbt3244a . 6.1 function table 7. limiting values [1] the performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. the maximum junction temperature of this integrated circuit should not exceed 150 c. [2] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. 8. recommended operating conditions table 3: function selection h = high voltage level; l = low voltage level; z = high-impedance off state inputs outputs 1 oe 2 oe 1an, 1bn 2an, 2bn l l 1an = 1bn 2an = 2bn l h 1an = 1bn z h l z 2an = 2bn hhz z table 4: limiting values in accordance with the absolute maximum rating system (iec 60134). [1] symbol parameter conditions min max unit v cc supply voltage - 0.5 +7.0 v i ik input clamping current v i <0v - - 18 ma v i input voltage [2] - 1.2 +7.0 v i ok output clamping current v o <0v - - 50 ma v o output voltage output in off or high state [2] - 0.5 +7.0 v i o output current output in low state - 128 ma t stg storage temperature - 65 +150 c table 5: operating conditions symbol parameter conditions min typ max unit v cc supply voltage 4.5 - 5.5 v v ih high-state input voltage 2.0 - - v v il low-state input voltage - - 0.8 v t amb ambient temperature operating in free-air - 40 - +85 c
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 6 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables 9. static characteristics [1] all typical values are at v cc =5v; t amb =25 c. [2] this is the increase in supply current for each input that is at the speci?ed ttl voltage level rather than v cc or gnd. [3] measured by the voltage drop between the a and the b terminals at the indicated current through the switch. on-state resista nce is determined by the lowest voltage of the two (a or b) terminals. 10. dynamic characteristics [1] this parameter is warranted but not production tested. the propagation delay is based on the rc time constant of the typical on-state resistance of the switch and a load capacitance of 50 pf, when driven by an ideal voltage source (zero output impedance). [2] output enable time to high and low level. [3] output disable time from high and low level. table 6: static characteristics t amb = - 40 c to +85 c symbol parameter conditions min typ [1] max unit v ik input clamping voltage v cc = 4.5 v; i i = - 18 ma - - - 1.2 v i li input leakage current v cc = 5.5 v; v i = gnd or 5.5 v - - 1 m a i cc quiescent supply current v cc = 5.5 v; i o = 0 ma; v i =v cc or gnd -13 m a d i cc [2] additional quiescent supply current (per input) v cc = 5.5 v; one input at 3.4 v, other inputs at v cc or gnd - - 2.5 ma c i input capacitance (control pins) v i = 3 v or 0 v; n oe = v cc -3-pf c io input/output capacitance n oe=v cc = 5.0 v - 3 - pf r on [3] on-state resistance v cc = 4.5 v; v i =0v; i i =64ma - 4 7 w v cc = 4.5 v; v i =0v; i i =30ma - 4 7 w v cc = 4.5 v; v i = 2.4 v; i i =15ma - 8 15 w table 7: dynamic characteristics t amb = - 40 c to +85 c; v cc = 5.0 v 0.5v; gnd=0v; c l = 50 pf; unless otherwise speci?ed. symbol parameter conditions min typ max unit t pd propagation delay [1] from nan input to nbn output, or from nbn input to nan output - - 0.25 ns t en enable time [2] from n oe input to nan or nbn output 1.0 - 5.6 ns t dis disable time [3] from n oe input to nan or nbn output 1.0 - 6.0 ns
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 7 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables 10.1 ac waveforms v m = 1.5 v; v i = gnd to 3.0 v t plz and t phz are the same as t dis . t pzl and t pzh are the same as t en . t plh and t phl are the same as t pd . fig 7. input to output propagation delays (1) waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. (2) waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. fig 8. 3-state output enable and disable times 002aab665 3.0 v 0 v v oh v ol t plh t phl 1.5 v 1.5 v input output 1.5 v 1.5 v 002aab666 3 v 3.5 v t plz 1.5 v 1.5 v output control (low-level enabling) output waveform 1 s1 at 7 v (1) 1.5 v t pzl v ol 0 v v ol + 0.3 v v oh 0 v 1.5 v v ol - 0.3 v output waveform 2 s1 open (2) t pzh t phz
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 8 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables 11. test information test data are given in t ab le 8 . all input pulses are supplied by generators having the following characteristics: prr 10 mhz; z o =50 w ; t r 2.5 ns; t f 2.5 ns. the outputs are measured one at a time with one transition per measurement. c l = load capacitance includes jig and probe capacitance. r l = load resistance. fig 9. test circuit table 8: test data test load switch c l r l t pd 50 pf 500 w open t plz /t pzl 50 pf 500 w 7v t phz /t pzh 50 pf 500 w open c l 50 pf 002aab667 500 w from output under test 500 w 7 v open gnd s1
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 9 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables 12. package outline fig 10. package outline sot764-1 (dhvqfn20) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 4.6 4.4 d h 3.15 2.85 y 1 2.6 2.4 1.15 0.85 e 1 3.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot764-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot764-1 dhvqfn20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 29 19 12 11 10 1 20 x d e c b a terminal 1 index area a c c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) 02-10-17 03-01-27
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 10 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables fig 11. package outline sot360-1 (tssop20) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot360-1 mo-153 99-12-27 03-02-19 w m b p d z e 0.25 110 20 11 pin 1 index q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 a max. 1.1
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 11 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables fig 12. package outline sot724-1 (ssop20) (qsop20) unit a 1 a 2 a 3 h e l p b p cd (1) e (1) z (1) el y w v q references outline version european projection issue date iec jedec jeita mm 0.25 0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 8.8 8.6 4.0 3.8 0.635 1 6.2 5.8 0.89 0.41 1.67 1.28 8 0 o o 0.18 0.25 0.1 dimensions (millimetre dimensions are derived from the original inch dimensions) note 1. plastic or metal protrusions of 0.2 mm maximum per side are not included. sot724-1 01-07-04 03-02-18 w m b p d h e e z e c v m a x a y 1 10 20 11 q a a 1 a 2 l p detail x l (a 3 ) mo-137 0 2.5 5 mm scale ssop20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm sot724-1 a max. 1.73 1/2 e
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 12 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables fig 13. package outline sot339-1 (ssop20) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p q (1) z y w v q references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 0.9 0.7 0.9 0.5 8 0 o o 0.13 1.25 0.2 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.2 mm maximum per side are not included. 1.03 0.63 sot339-1 mo-150 99-12-27 03-02-19 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 110 20 11 y 0.25 pin 1 index 0 2.5 5 mm scale ssop20: plastic shrink small outline package; 20 leads; body width 5.3 mm sot339-1 a max. 2
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 13 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables fig 14. package outline sot163-1 (so20) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec jeita mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 sot163-1 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1 99-12-27 03-02-19
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 14 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables 13. soldering 13.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. 13.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 cto270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: ? below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson..t and ssop..t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. ? below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 15 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 13.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 c and 320 c. 13.5 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [3] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. table 9: suitability of surface mount ic packages for wave and re?ow soldering methods package [1] soldering method wave re?ow [2] bga, htsson..t [3] , lbga, lfbga, sqfp, ssop..t [3] , tfbga, vfbga, xson not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [4] suitable plcc [5] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [5] [6] suitable ssop, tssop, vso, vssop not recommended [7] suitable cwqccn..l [8] , pmfp [9] , wqccn..l [8] not suitable not suitable
9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 16 of 18 philips semiconductors cbt3244a octal bus switch with quad output enables [4] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [6] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil. however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropriate soldering pro?le can be provided on request. [9] hot bar soldering or manual soldering is suitable for pmfp packages. 14. abbreviations 15. revision history table 10: abbreviations acronym description cdm charged device model esd electrostatic discharge hbm human body model mm machine model prr pulse rate repetition ttl transistor-transistor logic table 11: revision history document id release date data sheet status change notice doc. number supersedes cbt3244_2 20050915 product data sheet - 9397 750 13362 cbt3244a_1 modi?cations: ? the format of this data sheet has been redesigned to comply with the new presentation and information standard of philips semiconductors. ? added dhvqfn20 package option (affects section 2 f eatures , section 3 order ing inf or mation , section 5 pinning inf or mation , and section 12 p ac kage outline ? section 2 f eatures on page 1 , 6th bullet: changed from exceeds 1000 v hbm ... to exceeds 2000 v hbm ... ? added section 14 ab bre viations on page 16 cbt3244a_1 20040526 product data sheet - 9397 750 13281 -
philips semiconductors cbt3244a octal bus switch with quad output enables 9397 750 13362 ? koninklijke philips electronics n.v. 2005. all rights reserved. product data sheet rev. 02 15 september 2005 17 of 18 16. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 18. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 19. trademarks notice all referenced brands, product names, service names and trademarks are the property of their respective owners. 20. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2005 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 15 september 2005 document number: 9397 750 13362 published in the netherlands philips semiconductors cbt3244a octal bus switch with quad output enables 21. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 functional description . . . . . . . . . . . . . . . . . . . 5 6.1 function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 recommended operating conditions. . . . . . . . 5 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 6 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 10.1 ac waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13.2 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 14 13.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14 13.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 15 13.5 package related soldering information . . . . . . 15 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 16 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17 17 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 18 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 19 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 20 contact information . . . . . . . . . . . . . . . . . . . . 17

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